arXiv:2610.08543v1 Announce Type: new Abstract: Advanced electronic packaging structures represent a key technological approach for extending Moore's Law. An electronic packaging structure consists of multiple materials with distinct properties, constituting a composite structure with complex spatial architecture. This paper develops an unfitted cut finite element method (CutFEM) for transient heat conduction simulation in multi-material electronic packaging structures with complex material interfaces. In the proposed computational framework, the heterogeneous spatial geometric features of electronic packaging structures is embedded and characterized in a regular background mesh, thereby avoiding the generation of body-fitted meshes on complicated interfaces. Interface temperature and heat-flux transmission conditions are imposed by a coefficient-weighted symmetric Nitsche formulation. In addition, a ghost-penalty stabilization controls arbitrarily small intersections between the physical materials and background meshes. Furthermore, the semi-discrete and fully-discrete numerical schemes are proposed, and an explicit energy estimate is derived in detail. Finally, two-dimensional and three-dimensional electronic packaging structures containing substrate, molding compound, die, and solder balls are designed to validate its accuracy, efficiency, and scalability in simulating challenging transient thermal problems.