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Beyond Hotness: High-Resolution Memory Characterization of Cloud and LLM Workloads for Tiered Memory with ARM SPE
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arXiv:2610.32711v1 Announce Type: new Abstract: Memory demands from data analytics and LLM workloads grow rapidly, driving up memory costs in cloud and data centers. Multi-tier memory has emerged as a promising solution to balance performance and cost. However, effectively leveraging it requires a deep understanding of workload memory behaviors. This work introduces a high-resolution memory characterization methodology for analyzing workload-specific opportunities for multi-tier memory usage. In response to the increasing deployment of ARM-based processors in data centers, we implement our methodology using the recent Statistical Profiling Extension (SPE) for ARM. By characterizing eight memory-intensive workloads from CloudSuite and LLM applications, we identify region-specific access patterns, evaluate the effectiveness of cloud-oriented cache hierarchies, and propose new metrics based on memory idle periods and latency profiles to determine suitable data placement for tiered memory.
Source:https://arxiv.org/abs/2610.32711PreviousInferSlice: A Reference Architecture for SLO-driven LLM Inference over a Telco Wide-Area NetworkNextMigration as a Steady-State Execution Primitive: A Runtime for Virtual Stationarity in Low-Earth Orbit
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